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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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OSP Process Automotive PCB Board Double Sided IPC Class 3 Standard

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OSP Process Automotive PCB Board Double Sided IPC Class 3 Standard

Brand Name : xingqiang

Model Number : Varies by goods condition

Certification : ROHS, CE

Place of Origin : China

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 3000

Delivery Time : 7-10 work days

Min. Hole Size : 0.1mm

Standard : IPC Class3

Impedance Control : Yes

Solder Mask : Green/Red/Black/Blue/White

Through-Hole Capability : Yes

Board Thickness : 0.2mm~5.0mm

Surface Finish : HASL, ENIG, OSP

Surface Mount Capability : Yes

Surface Treatment : HASL Lead Free

Copper Thickness : 1-4 oz

Max Board Size : 528 mm x 600 mm

Type : SMT Assembly

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Double-sided OSP process


Product Description​
Double-sided OSP (Organic Solderability Preservative) process refers to a surface treatment technology applied to both sides of printed circuit boards (PCBs). It involves forming a thin, uniform organic protective film on the exposed copper surfaces of the double-sided board through chemical reactions. This film acts as a barrier against copper oxidation while preserving the board’s solderability. The process is compatible with double-sided wiring designs, supporting signal transmission for small to medium complexity circuits and adapting to the welding requirements of various conventional and precision components.

Core Characteristics​

Organic protective film: The OSP layer, typically 0.1-0.3μm thick, adheres tightly to the copper surface, providing oxidation resistance without compromising the original flatness of the copper.​

Double-sided application: Uniformly applied to both sides of the board, ensuring consistent protection and solderability across all exposed copper pads and traces.​

Process compatibility: Works well with standard PCB substrates (such as FR-4) and integrates seamlessly into conventional manufacturing workflows, with no negative impact on solder mask materials (e.g., red, blue, or green inks).


Main Advantages​

Excellent solderability retention: The organic film is easily removed during soldering, allowing for good wetting of the copper surface by solder, reducing the risk of cold solder joints and ensuring reliable connections, even for fine-pitch components.​

Cost-effectiveness: Compared to gold immersion or hot air solder leveling (HASL), the OSP process is simpler, requires fewer production steps, and has lower material costs, making it ideal for cost-sensitive applications.​

Environmental friendliness: Uses non-toxic organic compounds, avoiding heavy metals (like lead or gold) in large quantities, and generates less hazardous waste, aligning with modern environmental regulations.​

Thin and flat surface: The ultra-thin OSP layer does not significantly alter the board’s thickness or surface flatness, making it suitable for high-density circuit designs and applications where dimensional precision is critical.​



Product Tags:

OSP Process Automotive PCB Board

      

Automotive PCB Board Double Sided

      

IPC Class 3 Standard Automotive PCB

      
Quality OSP Process Automotive PCB Board Double Sided IPC Class 3 Standard for sale

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