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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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FR4 Material Through Hole Double Sided PCB Board For Medical Device

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FR4 Material Through Hole Double Sided PCB Board For Medical Device

Brand Name : xingqiang

Model Number : Varies by goods condition

Certification : ROHS, CE

Place of Origin : China

MOQ : Sample,1 pc(5 square meters)

Price : NA

Payment Terms : ,T/T,Western Union

Supply Ability : 3000

Delivery Time : 7-10 work days

Solder Mask : Green, Blue, Red, Black, White

Min. Hole Size : 0.2mm

Silkscreen : White, Black, Yellow

Max. Panel Size : 300mm*300mm

Surface Finish : HASL, ENIG, OSP

Min. Line Width/Spacing : 0.1mm/0.1mm

Testing : Flying Probe Test, X-Ray Inspection, AOI

Copper Thickness : 1/2oz-3oz

Min. Panel Size : 50mm*50mm

Thickness : 0.2-6.0mm

Layer : 2-8

Material : FR4

Special Technology : Blind and Buried Vias, Impedance Control, Gold Finger

Application : Medical PCB

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FR4 Green Soldermask HASL Material SMT Multilayer PCB Board

Product Description
FR4 through-hole double-sided board PCB is a printed circuit board made of FR4 epoxy glass fiber substrate, featuring double-sided wiring and through-hole technology. The FR4 material provides a stable base with excellent mechanical and electrical insulation properties. Both sides of the board are equipped with conductive circuits, connected by metal-plated through-holes (vias) that enable electrical continuity between the two layers. It is designed to accommodate through-hole components (such as resistors, capacitors, and connectors) which are inserted into pre-drilled holes and soldered to the pads on both sides, making it suitable for small to medium complexity electronic circuits.
Core Characteristics
  • FR4 substrate foundation: Utilizes FR4 material, known for its high strength, good heat resistance (operating temperature typically -55℃ to 130℃), and stable electrical insulation, ensuring structural and performance reliability.
  • Double-sided wiring with through-holes: Two layers of conductive circuits connected by plated through-holes, enabling signal transmission between layers and supporting basic circuit integration.
  • Through-hole component compatibility: Designed for through-hole mounting, with drilled holes and corresponding pads to secure and solder traditional through-hole components.
Main Advantages
  • Cost-effectiveness: FR4 is an economical substrate material, and the double-sided through-hole design involves simpler manufacturing processes (compared to multi-layer or SMT-only boards), resulting in lower production costs, ideal for budget-sensitive projects.
  • Ease of assembly and repair: Through-hole components are easier to manually insert, solder, and replace, facilitating assembly in small-scale production or repair scenarios, especially suitable for hobbyists, prototyping, or low-volume manufacturing.
  • Mechanical robustness: Through-hole soldering creates strong mechanical bonds between components and the board, enhancing resistance to vibration and mechanical stress, making it suitable for industrial equipment or devices subject to physical impact.
  • Versatility: Compatible with a wide range of traditional through-hole components, meeting the needs of various electronic applications such as power supplies, audio equipment, and basic control circuits.

Product Tags:

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